Encapsulation Materials / Compounds
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Coating varnishes for printed circuits.
Coating and encapsulating resins for electronic components.
Transparent resins for optoelectronics.
Hot melting resins
Alkyd varnish, lead-free, fluorescent, air drying, UL 94 V-0 VOC free coating varnishes
Arcylic varnish, lead-free, air drying, UL 94 V-0
Epoxy varnish, lead-free, air drying
1-component polyurethane, hot curing
2-component polyurethane, cold and hot curing
2-component silicone, cold and hot curing
1-component epoxy, hot and/or UV curing
2-component epoxy, hot curing
2-component PUR resins transparent/UV resistant
for transparent encapsulation of optical components
for fast and simple protection of electronics
Polyurethane or silicon up to 200 °C
Cleaning Agents for Printed Circuits