Two-component silicone gels Bectron® SG, addition-curing

€0,00

The Bectron® SG series is a two-component, addition-curing system made of very soft materials. The gels cure at room temperature, but can be accelerated by means of heat. Thanks to their elastic properties and heat resistance from -45 °C to +200 °C, they are successfully used for potting power electronics such as IGBTs or sensitive electronic devices and components that need to be protected against mechanical stress and vibrations.

Art.-Nr.
Master number Colour Mixed viscosity Pot life Pene- tration Thermal conductivity Curing time @ 25°C UL

(intern)
Resin Hardener [mPa*s] [min] [mm*10] [W/mK] [h]
GHSG75V1-15 GHSG79V1-15 colorless 3000 60 pen15 0,20 12 V0
GHSG75V1-60 GHSG79V1-60 colorless 350 120 pen60 0,20 24 V1
GHSG75V1-75 GHSG79V1-75 colorless 925 45 pen75 0,20 24 V1
GHSG75L2-30 GHSG79L5-30 bluish 10500 120 pen30 0,90 48 V1

 

Open the data sheet by clicking on the master number.

 

Sales units

Item number resin Sales unit [kg] Item number Crosslinker Sales unit [kg]
GHSG75V1-15/00950 1 GHSG75V1-15/00950 0,95
GHSH79V1-15/04000 4 GHSG75V1-15/04000 4
GHSG75V1-60/00950 0,95 GHSH79V1-60/00950 0,95
GHSG75V1-75/01000 1 GHSG79V1-75/01000 1
GHSG75V1-75/25000 25 GHSH79V1-75/25000 25
GHSG75L2-30/01000 1 GHSG79L5-30/01000 1
GHSG75L2-30/10000 10 GHSH79L5-30/10000 10
GHSG75L2-30/30000 30 GHSG79L5-30/30000 30

 

Hint

Data sheets are available on request or can be called up by clicking on the master number. The technical information is provided to the best of our knowledge. They do not release the user from the obligation to check the suitability of the product by carrying out his own tests. ® Registered trademarks / © Karl Schupp AG

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